Tinning & Electroplating

A.J. Oster offers a variety of tinned and electroplated products to meet our customers’ special needs.

Tin plating and electroplating systems are applied to enhance surface conditions and material performance.

Some reasons for tin plating

  • Fretting & Corrosion resistance
  • Appearance and cosmetics
  • Solderability
  • Lower insertion force
  • Contact resistance

Hot Tin Dip - Mechanical Wipe

Thickness
20 – 100 micro inches / 0.50 – 2.0 microns

Characteristics

  • No tin whiskers
  • Thin, hard coating
  • Low insertion force
  • Poor solderability and electrical performance
  • Dull streaked surface / cloudy
  • Nearly 100% IMC (Intermetallic Compound) in initial condition

Hot Tin Dip - HALT (Hot Air Level)

Process involves air ‘knives’ blowing excess tin off metal surface after tin dipping.

Characteristics

  • Thicker than mechanical wipe
  • Higher insertion force
  • Better solderability

Matte Tin

Characteristics

  • Higher insertion force
  • Good solderability
  • Good electrical performance
  • Can be plated selectively

Reflow Tin

Process produces the best mirror reflective surface, and can provide lowest insertion force possible on multi-way connectors.

Thickness
20 –130 micro inches /  0.5 – 3.3 microns

Characteristics

  • Uniformity of coating
  • Excellent cosmetics
  • No tin whiskers
  • Barrier layer can be applied
  • Low insertion force
  • Excellent solderability and electrical performance
  • Allows thin coating to survive 125ºC+ for 3,000 hours

Advanced Tin Barrier™– Retards IMC growth, provides improved electrical performance, lowers whisker propensity

 

• Other plating system includes Nickel, Gold, Silver, and Palladium which offer excellent performance for many connector applications.

 

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